Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti/Au, Ti/Pt, Cr/Au, and Cr/Pt. Our E-Beam Evaporation process provides excellent film thickness uniformity. Evaporation is done at low temperatures that will not damage photoresist for metal lift-off. Our process capabilities allow us to deposit up to six different materials... (read more)

Bunting Metal Detector-Separators detect and automatically purge all types of metal contaminants from gravity or pneumatically conveyed dry materials. Bunting units feature programmable Product Effect Compensation plus adjustable sensitivity settings and flap-opening times to minimize loss of good product. Models are also available for liquids, pastes, and slurries. (read more)

All Metals & Forge LLC (an ISO-9001:2000/AS9100/EN9100 certified supplier) of quality metals and forgings to the oil and gas industry. Whether your need is bar, sheet, plate or forged parts for oil rig repair, maintenance or development, All Metals & Forge LLC can supply your material needs from alloys steels to titanium in all mill and open die forged forms. (read more)

MicroGrid® precision-expanded foils from Dexmet are used in batteries, electronics, aerospace, medical, packaging, and wherever mesh and perforated foils with high precision, mechanical and electrical properties or EMI/ RFI shielding capabilities are required. (read more)

Explosive bonding of metals allow design engineers to place a certain material exactly where they need it in the design, without compromising other critical design elements. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices foundry can provide Sputtered Metals and Sputtered Dielectrics. Our sputtering capabilities include PVD Metals, PVD Dielectrics, and Evaporated Metals including but not limited to Copper, Aluminum, Silicon, Silicon Nitride, and Evaporated precious metals on wafers sizes 50mm to 300mm in diameter. (read more)

Rogue Valley Microdevices provides PVD Metals including sputtered Copper, sputtered Tantalum, sputtered Titanium, sputtered Tungsten, sputtered Nickel, sputtered Chrome, and sputtered Aluminum. Our process has an in-situ RF etch that ensures good film adhesion and Ohmic contact to conductive layers. We can provide the metal barrier layers and dielectric films on wafers sizes 50mm to 300mm. (read more)

Forged load binders are available in Dixie Industries, Midland Forge, and Durbin Durco brand names. Popular lever and ratchet styles are available as well as specialty binders. (read more)

Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti/Au, Ti/Pt, Cr/Au, and Cr/Pt. Our E-Beam Evaporation process provides excellent film thickness uniformity and is done at low temperatures that will not damage photoresist for metal lift-off. Our process capabilities allow us to deposit up to six different materials in-situ if required. (read more)